Micralyne Inc., a growing MEMS and microfluidics foundry, appear today that Project Engineer, Mr. Dean Spicer, will be speaking next anniversary at The 2009 IEEE International Interconnect Technology Conference (IITC) on Tuesday, June 2.
The attendees of the twelfth IITC conference, amid in Sapporo, Hokkaido, Japan, will crop in Mr. Spicer’s affiche affair from 1.30 p.m. until 3:30 p.m. at the Royton Sapporo Hotel, Royton Hall A/B.
Spicer will be presenting on the affair Thin-Layer Au-Sn Solder Bonding Process for Wafer-Level Packaging, Electrical Interconnects and MEMS Applications. The after-effects accepting presented were acquired aural a development affairs for a MEMS-based anamnesis device. Wafer-to-wafer bonding is a key action in MEMS wafer-level packaging (WLP).
The developed MEMS dent bonding action utilizes gold-tin adhesive electroplating and provides liquid-proof sealing and assorted reliable electrical access amid the affirmed wafers. The dent band can bear 300ºC and appearance a attenuate band band (2-3 ?m), top band strength, accomplished band gap control, and low accent due to baby aggregate of bonding material.
About Micralyne
Micralyne is one of the world’s largest, independent, MEMS development and MEMS accomplishment account providers. With its address in Edmonton, Alberta, Canada, Micralyne casework a assorted chump abject with applications in, automotive sensors for ascendancy systems, lab-on-a-chip accessories for biologic discovery, MEMS optical switching and abrasion technology in telecommunication networks, optical ablaze valves for computer-to-print applications and sensors for a array of applications such as oil and gas analysis and actinic analysis.
Craig Blackburn
Micralyne Inc.
1911 - 94 Street
Edmonton, Alberta
Canada T6N 1E6
Phone: 780-431-4400
www.micralyne.com
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